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This position requires a deep understanding of device physics, components design and silicon manufacturing processes. Proficiency in circuit simulation, layout review, data analysis, and SPICE/EM modeling is essential. FPGA design experience is preferred. Strong collaboration and communication skills are critical, as the position involves working closely with cross-functional teams.
Job Responsibility:
Perform device characterization, SPICE modeling and simulation support to FPGA product design
Responsible for design, optimize, and validate baseband and RF components in advanced CMOS nodes
Perform schematic design and simulations using Cadence Virtuoso, Spectre, and HSPICE
Guide and review layout implementation to ensure optimal device performance and manufacturability
Analyze silicon measurement data and correlate with simulation models to enhance design accuracy
Conduct SPICE and EM modeling using tools such as ICCAP, HFSS or EMX
Explore and evaluate stacked-die and 3DIC technologies, including simulation, modeling and layout consideration for heterogeneous integration
Collaborate with foundry and internal teams to utilize and validate PDKs, perform parasitic extraction, and ensure physical verification compliance
Requirements:
Bachelors degree in engineering or physical science, preferably with advanced degree (MS or PhD)
Working experience in baseband and RF component design and modeling
Proficiency in industry-standard EDA tools including Cadence Virtuoso, Spectre, and HSPICE
Strong background in SPICE modeling and QA for semiconductor devices
Familiar with foundry PDKs, parasitic extraction, and physical verification flows
Experience with EM simulation and modeling tools such as HFSS, EMX and ICCAP
Working knowledge of FinFET and GAA technologies at 3nm, 2nm, and beyond
Nice to have:
Experience with simulation and modeling in 3DIC and stacked technology is a plus
Knowledge with experience in FPGA design is a strong plus
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